A food manufacturer’s packaging line represents both the last opportunity to protect food and the last place where risk can ...

In today''s globalized and highly competitive food industry, packaging is no longer a secondary process added at the end of ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Digital packaging bridges the gap between limited physical space and the growing demand for transparency, playing a crucial role in delivering sustainability insights that benefit brands and consumers ...

NBi FlexPack, the US-based manufacturer of flexible packaging, has adopted electron beam (eBeam) coating technology to add cast and cure graphics to its digitally printed packaging products.

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...

Since plastic packaging accounts for a large fraction of plastic waste, the demand for environmentally friendly packaging ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

BANGKOK — Investment in packaging and processing technologies across Southeast Asia is expected to remain resilient this year, supported largely by strong demand from the food and beverage sector and ...